IPC Standards

While we can't publish the actual IPC standards, we're hoping this summary page of IPC standards and relevant core specifications will be of assistance. We believe that designers have the power to control the cost and quality of their product for the long term by specifying materials and inspection considerations via IPC standards. This allows the latest specifications to be used in the build and approval of products throughout their lives.


Click a specific IPC Specification below for more information.

Design
IPC-2221	Generic Standard on Printed Board Design
IPC-2222	Sectional Design Standard for Rigid Organic Printed Boards
IPC-2223	Sectional Design Standard for Flexible / Rigid-Flexible Printed Boards

Base Dielectric, Foils, and Adhesives for Flex Applications
IPC-4101	Base Materials (laminates) for Rigid & Multilayer PCBs
IPC-4104	High Density Interconnect (HDI) and Microvia Materials
IPC-4202	Flexible Base Dielectrics for Use in Flexible Printed Boards
IPC-4203	Cover and Bonding Material for Flexible Printed Circuitry
IPC-4204	Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-4562	Metal Foil for Printed Wiring Applications

Performance Specifications
IPC-A-600	Acceptability of Printed Boards
IPC-6012	Spec for Rigid PCBs
IPC-6013	Spec for Flexible / Rigid-Flexible Printed Boards
IPC-6018	Spec for High Frequency (Microwave) Printed Boards

 

Final Finishes
IPC-4552	Electroless Nickel/Immersion Gold (ENIG) Plating for PCBs
IPC-4553	Immersion Silver Plating for Printed Circuit Boards
IPC-4554	Immersion Tin Plating for Printed Circuit Boards
IPC-4556	ENEPIG Plating for Printed Circuit Boards
ASTM-B-488	Electrodeposited Coatings of Gold for Engineering Uses
MIL-G-45204	Electrodeposited Gold Plating on Metallic Surfaces

Electrical Testing
IPC-9252	Electrical Testing of Unpopulated Circuit Boards

 (Click on above links for more detail)