Final Finishes
Rate Characteristics Chart
Effects |
IPC Thickness Requirements |
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| Final Finish |
Product Shelf Life |
Deposit STRUCT |
Uniform Planar |
Solder |
Hand |
HUM |
SW Cont ACT |
IPC 6012 / 6013 |
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HASL |
12 mths | Dipped | Low | High | Low | Low | High | Coverage & Solderable | ||||||||||
LF/HASL |
12 mths | Dipped | Low | High | Low | Low | High | Coverage & Solderable | ||||||||||
| Soft Gold | n/a | EP | Ultrasonic Wirebond Ni: 118 µ" min Au: 1.97 µ" min Thermosonic Wirebond Ni:118 µ" min Au (Cls 2):11.8 µ" min Au (Cls 3):31.5 µ" min |
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Hard Gold |
n/a | EP | High | Low | Low | Low | Low | Connectors: Ni: 98.4 µ" Min Au (Cls 2): 31.5 µ" Min Au (Cls 3): 49.21 µ" Min |
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Immersion Gold |
6 mths | Immersion | High | Med | High | High | Med |
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Immersion Silver |
n/a | Immersion | High | High | Med | Low | Med | Coverage & Solderable | ||||||||||
| Immersion Tin |
3 mths | Immersion | High | Med | High | High | High | Coverage & Solderable | ||||||||||
OSP |
3 mths | Coated | High | Med | High | High | High | Solderable | ||||||||||
ENEPIG |
n/a | Immersion | High | High | Med | Low | Med | Ni: 118 - 236 µ" Pd: 2 - 12 µ" Au: 1.2 µ" Min |
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| ENIG | n/a | Immersion | High | Med | Low | Med | Ni:118 µ" Min; Au:1.97 µ" Min Ni (Rigid):118-236 µ", Ni (Flex):50 - 236 µ", Au:1.58 - 3.94 µ" |
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Circuit Board Surfaces Analysis
The Final Finishes Resource Center addresses concerns throughout the PCB supply chain by providing technical research and information pertaining primarily to: Fabrication Design Assembly Here you will find information on the leading surface finishes available for your bare printed circuit board.
Final Finish Comparison Chart
Compare final finish characteristics such as:- Panel cost
- Flatness
- Shelf life
- Handling
- North American availability
Relevant Links
- Pb-free HASL
- IPC-6012
- IPC-6013
- ENEPIG
- ENIG
- HASL
- Pb-free HASL
- OSP
- Immersion Silver
- Immersion Tin
- Deep Gold
- Soft, Wire Bondable Gold