Technology Roadmap

Customer-Driven Technological Capability

Saturn Flex’s FPC / Rigid-Flex PCB manufacturing capabilities are among the Industry Leaders and continue to grow year-by-year at rapid rate. Compounding this growth are our increased advanced capabilities for rigid PCBs including open cavities, HDI, sequential laminations, and extreme heavy copper. If there is a demand for a given process, Saturn Flex will make the necessary investments to add capability.

Capabilities at a Glance
Layer Count 1 - 24+
Largest Panel Size 18" x 24"
Smallest Circuit Width/Spacing .003 mils, .002 mils proto
Material Types Polyimide, PET, LPC, FR4, Teflon, Arlon,
Metal-Core Heat Sinks
Smallest Mech. Drilled Hole .004"
Hole Size/Dim. Tolerances +/- .003" and +/- .002"
Finishes/Lead Free
HASL, Immersion Silver/Gold,
Deep Gold, Pb-Free HASL
Electrical Testing Flying Probe
Fabrication Routing & Scoring, Array Layouts
Plasma Processing Unit
Printed Electronics with Silver
Ink Bumping, Metal-Core, Heat Sink
Laser Drilling, Routing and Trimming













Production Capabilities



Feature Current Capability Future Capabilities
Substrate Minimum Thickness .001" .001"
Max. Operating Temperature 356F 500F
Maximum Layer Count 24+ 30+
Silver Conductive Ink Impedance < 6 mΩ / Sq / Mil < 6 mΩ / Sq / Mil








Feature Current Capability Future Capabilites
Min. Finished Hole Size       
.002" .001"
Blind/Buried Vias .003" - .002" .001"
Routing Tolerance .005" .005"
Scoring Tolerance .005" .005"








Feature Current Capability Future Capabilites
Min. Lines/Spaces              
.002" .001"
Min. Quad Flat Pack Pitch .016" .016 - .012'
Min. Pad Size .004" .004" - .003"
Soldermask Registration .003" .002"
Soldermask Tolerance .002" .002"







Plating & Surface Finishes

Feature Current Capability Future Capabilites
Finished Cu Thickness       
20 oz. 20 oz.
Hot Air Solder Leveling Yes Yes
Lead-Free Solder (HAL) Yes Yes
Full Body Hard Ni/AU Yes Yes
Immersion Gold/Silver Yes Yes
OSP Yes Yes