Technology Roadmap
Customer-Driven Technological Capability
SFS FPC / Rigid-Flex manufacturability continues its rapid growth.We also upgraded our rigid capabilities to now include cavities, HDI, sequential lamination, and heavy copper.
If there is a demand for a given process, Saturn Flex will make the necessary investments to add capability.
SFS Capabilities at a Glance | |
Layer Count | 1 - 48+ |
Largest Panel Size | 30" x 30" |
Smallest Circuit Width / Spacing | .003", .002" proto |
Material Types | Polyimide, PET, LPC, FR4, Teflon, Arlon, Metal Heatsink |
Min. Mech. Drilled Hole | .003" |
Hole Size / Dimensional Tolerances | +/- .003" and +/- .002" |
Final Finishes |
HASL, Immersion Ag/Au/Sn, Deep Au, ENIG, ENEPIG, OSP |
Lead Free Finishes | Pb-Free HASL |
Electrical Testing | Flying Probe |
Fabrication | Routing, Beveling, Scoring Array Layouts |
Plasma Processing Unit |
Printed Electronics Ag Ink Bumping, Metal-Core, Heatsink |
Laser | Drilling, Routing and Trimming |
Materials
Feature | Capability |
Substrate Min Thickness | .001" |
Max Operating Temperature | 356F |
Max. Finished Cu Thickness | 20 oz |
Ag Conductive Ink Imped | < 6 mΩ / Sq / Mil |
Fabrication
Feature | Capability |
Min. Finished Through Hole Size |
.004" |
Min. Blind Via Diameter | .002" |
Routing Tolerance | .005" |
Scoring Tolerance | .005" |
Imaging
Feature | Capability |
Min Lines / Spaces |
.002" |
Min Quad Flat Pack Pitch | .016" |
Minimum Pad Size | .004" |
Soldermask Registration | .003" |