Capabilities

Customer-Driven Technological Capability
Saturn Flex’s FPC / Rigid-Flex PCB manufacturing capabilities are among the Industry Leaders and continue to grow year-by-year at rapid rate. Compounding this growth are our increased advanced capabilities for rigid PCBs including open cavities, HDI, sequential laminations, and extreme heavy copper. If there is a demand for a given process, Saturn Flex will make the necessary investments to add capability.

Capabilities at a Glance
Layer Count	1 - 24+
Largest Panel Size	18" x 24"
Smallest Circuit Width/Spacing	.003 mils, .002 mils proto
Material Types	Polyimide, PET, LPC, FR4, Teflon, Arlon, Metal-Core Heat Sinks
Smallest Mech. Drilled Hole	.004"
Hole Size/Dim. Tolerances	+/- .003" and +/- .002"
Finishes/Lead Free	HASL, Immersion Silver/Gold, Deep Gold, Pb-Free HASL
Electrical Testing	Flying Probe
Fabrication	Routing & Scoring, Array Layouts
Plasma Processing Unit	Printed Electronics with Silver Ink Bumping, Metal-Core, Heat Sink
Laser	Drilling, Routing and Trimming

Materials

Feature	Current Capability	Future Capabilities
Substrate Minimum Thickness	.001"	.001"
Max. Operating Temperature	356F	500F
Maximum Layer Count	24+	30+
Silver Conductive Ink Impedance	< 6 mΩ / Sq / Mil	< 6 mΩ / Sq / Mil

Fabrication

Feature	Current Capability	Future Capabilites
Min. Finished Hole Size	.002"	.001"
Blind/Buried Vias	.003" - .002"	.001"
Routing Tolerance	.005"	.005"
Scoring Tolerance	.005"	.005"

Imaging

Feature	Current Capability	Future Capabilites
Min. Lines/Spaces	.002"	.001"
Min. Quad Flat Pack Pitch	.016"	.016 - .012'
Min. Pad Size	.004"	.004" - .003"
Soldermask Registration	.003"	.002"
Soldermask Tolerance	.002"	.002"

Plating & Surface Finishes

Feature	Current Capability	Future Capabilites
Finished Cu Thickness	20 oz.	20 oz.
Hot Air Solder Leveling	Yes	Yes
Lead-Free Solder (HAL)	Yes	Yes
Full Body Hard Ni/AU	Yes	Yes
Immersion Gold/Silver	Yes	Yes
OSP	Yes	Yes